Networking / Telecom

Accelerating enterprise performance

Networking / TelecomNetworking / Telecom
Solutions to Unique ChallengesTechnologiesRecommended ProductsFeatured StoriesDownloads

Solutions to Unique Challenges

Growing demand for higher computing network appliances at the edge, such as RU and DU for scaling virtualization deployment, is driven on by the Open Radio Network structure in the 5G era. Telco/ISPs are struggling to provide higher SPEC DRAM/NAND storage at the edge due to a lack of chassis space, fluctuating temperatures, and environmental erosions.

With its expertise in co-design and validation, ATP meets the demand for hardware and software design that must adhere to stringent service level commitments.

Unique Challenges & Atp Solutions

Embedded form factors for boot/cache drives
  • SSDs with power loss protection
  • SATA: M.2 2280/2242, mSATA, 2.5", CFast
  • NVMe: M.2 2280/2230, HSBGA
Need to maintain BOM consistency for long lifetime
  • 5 years+ longevity and BOM control
Data integrity/reliability
  • End-to-end data path protection - CRC, SRAM/DRAM/NAND ECC, NAND RAID
Wide ambient temperature support
  • Industrial temperature operation
  • High/Low temperature reliability validation
  • Thermal cycling validation
  • Thermal vs. Performance characterization & solutioning
  • Heatsink solutions
High Read and Write endurance (TBW/DWPD)
  • High-endurance 3D TLC/pSLC/SLC series
  • Capacity overprovisioning settings
Sustained write throughput
  • Configuration optimization - NAND mode selection, cache tuning, overprovisioning settings, firmware tuning
Surprise power loss or glitch protection
  • MCU-based power loss protection (PLP)
  • Customized power cycling tests
  • Sudden Power-Off Recovery (SPOR) by firmware
Data Security
  • AES, TCG-Opal 2.0, Self-Encrypting Drive
  • Secure Erase
  • Customized encryption security
Environmental and safety homologation
  • Global Certifications
  • FCC, CE, UKCA, VCCI, BSMI, KCC, RCM, IC, UL, CB, CSA, Morocco, etc. (optional)
  • ROHS, REACH
Customized validation
  • Collaboration on customer specific test, qualification, and validation that are beyond JEDEC standards
  • Performance/Latency, Power consumption, Endurance, Data Retention, 4 Corner power cycling and thermal testing, Signal Integrity, system interoperability, reliability testing, etc.
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

Nowadays, the heart of virtually all industries is networking and cybersecurity, encompassing a variety of network-related appliances. Together, ATP builds solutions that drive toward greater computing that upscales software defined solutions for providers across the board, including gateway, UTM, NGFW, managed switch, and all sorts of servers.

Today, over 70% of companies listed on Gartner’s Magic Quadrant report for Primary Storage, Data Center and Cloud Computing, and WAN-Edge Infrastructure consider ATP as a strategic supplier.

Unique Challenges & Atp Solutions

Embedded form factors for boot/cache drives
  • SSDs with power loss protection
  • SATA: M.2 2280/2242, mSATA, 2.5", CFast
  • NVMe: M.2 2280/2230, HSBGA
Need to maintain BOM consistency for long lifetime
  • 5 years+ longevity and BOM control
Data integrity/reliability
  • End-to-end data path protection - CRC, SRAM/DRAM/NAND ECC, NAND RAID
Wide ambient temperature support
  • Industrial temperature operation
  • High/Low temperature reliability validation
  • Thermal cycling validation
  • Thermal vs. Performance characterization & solutioning
  • Heatsink solutions
High Read and Write endurance (TBW/DWPD)
  • High-endurance 3D TLC/pSLC/SLC series
  • Capacity overprovisioning settings
Sustained write throughput
  • Configuration optimization - NAND mode selection, cache tuning, overprovisioning settings, firmware tuning
Surprise power loss or glitch protection
  • MCU-based power loss protection (PLP)
  • Customized power cycling tests
  • Sudden Power-Off Recovery (SPOR) by firmware
Data Security
  • AES, TCG-Opal 2.0, Self-Encrypting Drive
  • Secure Erase
  • Customized encryption security
Environmental and safety homologation
  • Global Certifications
  • FCC, CE, UKCA, VCCI, BSMI, KCC, RCM, IC, UL, CB, CSA, Morocco, etc. (optional)
  • ROHS, REACH
Customized validation
  • Collaboration on customer specific test, qualification, and validation that are beyond JEDEC standards
  • Performance/Latency, Power consumption, Endurance, Data Retention, 4 Corner power cycling and thermal testing, Signal Integrity, system interoperability, reliability testing, etc.
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

While experiencing exponential expansion, storage server and cloud service providers also confront difficulties with data integrity, reliability, and other factors that are crucial to perpetual up-time. Boot drives, server DRAM, and other uncommon embedded form factors are areas of expertise for ATP.

Today, ATP is regarded as a strategic supplier by more than 70% of the businesses included in Gartner's Magic Quadrant reports for Primary Storage, Data Center and Cloud Computing, and WAN-Edge Infrastructure.

Unique Challenges & Atp Solutions

Embedded form factors for boot/cache drives
  • SSDs with power loss protection
  • SATA: M.2 2280/2242, mSATA, 2.5", CFast
  • NVMe: M.2 2280/2230, HSBGA
Need to maintain BOM consistency for long lifetime
  • 5 years+ longevity and BOM control
Data integrity/reliability
  • End-to-end data path protection - CRC, SRAM/DRAM/NAND ECC, NAND RAID
Wide ambient temperature support
  • Industrial temperature operation
  • High/Low temperature reliability validation
  • Thermal cycling validation
  • Thermal vs. Performance characterization & solutioning
  • Heatsink solutions
High Read and Write endurance (TBW/DWPD)
  • High-endurance 3D TLC/pSLC/SLC series
  • Capacity overprovisioning settings
Sustained write throughput
  • Configuration optimization - NAND mode selection, cache tuning, overprovisioning settings, firmware tuning
Surprise power loss or glitch protection
  • MCU-based power loss protection (PLP)
  • Customized power cycling tests
  • Sudden Power-Off Recovery (SPOR) by firmware
Data Security
  • AES, TCG-Opal 2.0, Self-Encrypting Drive
  • Secure Erase
  • Customized encryption security
Environmental and safety homologation
  • Global Certifications
  • FCC, CE, UKCA, VCCI, BSMI, KCC, RCM, IC, UL, CB, CSA, Morocco, etc. (optional)
  • ROHS, REACH
Customized validation
  • Collaboration on customer specific test, qualification, and validation that are beyond JEDEC standards
  • Performance/Latency, Power consumption, Endurance, Data Retention, 4 Corner power cycling and thermal testing, Signal Integrity, system interoperability, reliability testing, etc.
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

From Whitebox uCPE makers to turnkey solution providers, the SD-WAN industry has struggled to strike a balance between ideal OPEX and practical CAPEX. An achievable OPEX within the service level agreement is ensured by a better endurance DRAM/NAND at a reasonable cost.

Today, leading SD-WAN solution providers consider ATP as a strategic supplier, we’d like to show you why

Unique Challenges & Atp Solutions

Embedded form factors for boot/cache drives
  • SSDs with power loss protection
  • SATA: M.2 2280/2242, mSATA, 2.5", CFast
  • NVMe: M.2 2280/2230, HSBGA
Need to maintain BOM consistency for long lifetime
  • 5 years+ longevity and BOM control
Data integrity/reliability
  • End-to-end data path protection - CRC, SRAM/DRAM/NAND ECC, NAND RAID
Wide ambient temperature support
  • Industrial temperature operation
  • High/Low temperature reliability validation
  • Thermal cycling validation
  • Thermal vs. Performance characterization & solutioning
  • Heatsink solutions
High Read and Write endurance (TBW/DWPD)
  • High-endurance 3D TLC/pSLC/SLC series
  • Capacity overprovisioning settings
Sustained write throughput
  • Configuration optimization - NAND mode selection, cache tuning, overprovisioning settings, firmware tuning
Surprise power loss or glitch protection
  • MCU-based power loss protection (PLP)
  • Customized power cycling tests
  • Sudden Power-Off Recovery (SPOR) by firmware
Data Security
  • AES, TCG-Opal 2.0, Self-Encrypting Drive
  • Secure Erase
  • Customized encryption security
Environmental and safety homologation
  • Global Certifications
  • FCC, CE, UKCA, VCCI, BSMI, KCC, RCM, IC, UL, CB, CSA, Morocco, etc. (optional)
  • ROHS, REACH
Customized validation
  • Collaboration on customer specific test, qualification, and validation that are beyond JEDEC standards
  • Performance/Latency, Power consumption, Endurance, Data Retention, 4 Corner power cycling and thermal testing, Signal Integrity, system interoperability, reliability testing, etc.
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

Featured Technologies

End-to End Data Path Protection
Ensures error checking and correction as data moves from the host to the storage device controller and vice versa. By covering the entire data path, end-to-end protection guarantees integrity at any point during data transfer
Industrial Temperature
Operational stability in extreme temperatures from -40°C to 85°C.
Hardware-Based In-Flight-Data Power Loss Protection
#ATP EXCLUSIVE
This hardware-based power failure protection prevents data loss during a power loss event by ensuring that the last read/write/erase command is completed and data is stored safely in non-volatile flash memory. Select NVMe modules and SATA SSDs feature a new microcontroller unit (MCU)-based design that allows the PLP array to perform intelligently in various temperatures, power glitches and charge states to protect both device and data.
Read more
Firmware-Based Data-At-Rest Power Loss Protection
The firmware-based power failure protection effectively protects data written to the device prior to power loss. After the host receives a signal from the device that the WRITE operation has been successfully completed, newly written as well as previously written data are protected even if a sudden power loss occurs.
Wide Temp DRAM Modules

These modules use unique ATP testing and technologies to enable support for industrial temperature operating ranges from -40°C to 85°C but at lower price points than modules with native industrial grade ICs.

Test During Burn-In (TDBI)

TDBI involves subjecting ATP DRAM modules to various temperatures, power cycling, voltages and other stress conditions within a certain period. It aims to cause weak ICs to fail so they can be screened out, thus making sure that the modules contain only the most robust ICs.

Read more

Anti-Sulfur Resistors
ATP DRAM modules and NAND flash storage products offer an anti-sulfur resistor option to prevent the corrosive effects of sulfur contamination, guaranteeing continued dependable performance for a long time.
Conformal Coating

Protects electronic circuits with a coating of the chemical compound Parylene to resist dust, chemical contaminants, extreme temperature, moisture and corrosion.

Read more

SecurEncrypt

AES-256 encryption for the User Data area.

Learn more

TCG Opal
Plus other features defined for data storage devices by the Trusted Computing Group.
View All Technologies

Recommended Products

Specifications

View product
Industrial Enterprise PCIe® Gen4 NVMe SSDs
NamingN651SieN651SieN651Sie
InterfacePCIe G4 x4PCIe G4 x4PCIe G4 x4
Form FactorM.2U.2E1.S
Dimensions (mm)80 x 22 x 3.85100 x 69.85 x 15118.75 x 33.75 x 9.5
Flash TypeTLCTLCTLC
Capacity120 GB to 1.92 TB 480 GB to 7.68 TB480 GB to 7.68 TB
Sequential Read (MB/s) up to 1,6,76,4506,0006,100
Sequential Write (MB/s) up to 1,6,76,0505,5006,000
Random Read KIOPS up to 2,6,71,100820870
Random Write KIOPS up to 2,6,71,2501,2001,200
Sustained Sequential Write (MB/s) up to 3,6,73,0003,2003,200
Sustained Random Write up to 4,6,7250 KIOPS (1,000 MB/s)320 KIOPS (1,280 MB/s)320 KIOPS (1,280 MB/s)
Endurance [DWPD] 8Available in 1, 2, and 5 DWPD configurationsAvailable in 1, 2, and 5 DWPD configurationsAvailable in 1, 2, and 5 DWPD configurations
QoS 99.9999% 5,6,7Read <90µs | Write <10µsRead <80µs | Write <10µsRead <80µs | Write <10µs
Data Retention1 year at 55°C (100% P/E cycles)1 year at 55°C (100% P/E cycles)1 year at 55°C (100% P/E cycles)
Power Loss ProtectionYesYesYes
End to End Data Path ProtectionYesYesYes
Sustained Read Power (Max) 7<9W<14.5W<13W
Sustained Write Power (Max) 7<11.5W<17.5W<15.5W
Supply Voltage3.3V12V12V
Operating Temperature Tc-40°C to 85°C (I-Temp)-40°C to 85°C (I-Temp)-40°C to 85°C (I-Temp)
Storage Temperature Tc-40°C to 85°C-40°C to 85°C-40°C to 85°C
VibrationSine 16.4G,10~2,000HzSine 16.4G,10~2,000HzSine 16.4G,10~2,000Hz
ShockHalf sine 1,500G/0.5msHalf sine 1,500G/0.5msHalf sine 1,500G/0.5ms
Reliability MTBF @ 25°C>3,000,000 hours>3,000,000 hours>3,000,000 hours
UBER<1 sector per 10^17 bits read<1 sector per 10^17 bits read<1 sector per 10^17 bits read
Warranty5 years5 years5 years

1. Sequential Burst Performance tested with IOmeter 4MB, QD64 
2. Random Burst Performance tested with IOmeter 4KB, QD64
3. Average Sustained Sequential Write Performance tested with IOmeter, 4MB, QD64 for 4 hours 
4. Average Sustained Random Write Performance tested with IOmeter, 4KB, QD64 for 4 hours
5. 4KB Random QD=1 
6. Actual performance may vary depending on user conditions and system environment
7. Parameters tested with highest capacity drive 
8. DWPD for 5 years tested with JESD219A Enterprise workload

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