e.MMC Industrial
Key Features
- Robust Data Integrity* (AutoRefresh and Dynamic Data Refresh)
- Extra-high endurance: 2-3X higher than standard e.MMC*
- Smaller footprint package size*
- Complies with JEDEC e.MMC v5.1 Standard (JESD84-B51)
- 153-ball FBGA (RoHS compliant, "green package")
- LDPC ECC engine*
Description
The ATP industrial e.MMC is an advanced storage solution that integrates NAND flash memory, a sophisticated flash controller, and a fast MultiMedia Card (MMC) interface in the same package. By incorporating these components in an integrated package, ATP e.MMC manages all background operations internally, freeing the host from handling low-level flash operations for faster and more efficient processing.
Smaller than a typical postage stamp, ATP e.MMC comes in a 153-ball fine pitch ball grid array (FBGA package). The tiny footprint makes it perfectly suitable for embedded systems with space constraints but require rugged endurance, reliability and durability in harsh environments.
ATP e.MMC is built to meet the tough demands of industrial applications. As a soldered-down solution, it is secure against constant vibrations. Its industrial temperature rating means that severe scenarios from freezing cold -40°C to blistering hot 105°C will not cause adverse impact on the device or the data in it.
Compliant with the latest JEDEC e.MMC 5.1 Standard (JESD84-B51), ATP e.MMC features Command Queuing and Cache Barrier to enhance random read/write performance; High Speed 400 (HS400) DDR Mode for a bandwidth of up to 400 MB/s; and field firmware update (FFU). Enhanced Strobe in HS400 Mode facilitates faster synchronization between the host and the e.MMC device; and, Secure Write Protection ensures that only trusted entities can protect or unprotect the e.MMC device.
It is backward compatible with previous versions (v4.41/v4.5/v5.0), supporting features such as power-off notifications, packed commands, cache, boot or replay protected memory block (RPMB) partitions, high priority interrupt (HPI), and hardware (HW) reset.
SpecificationsLatest Update: 2025-03-24 14:54
| e.MMC Industrial | |||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Product Name | Extended Industrial Grade | Extended Industrial Grade | Extended Industrial Grade | Extended Industrial Grade | Industrial Grade | Industrial Grade | Industrial Grade | Industrial Grade | Industrial Grade | Industrial Grade | Industrial Grade | Commercial Grade | Commercial Grade | Commercial Grade | Commercial Grade | Commercial Grade | Commercial Grade |
| Product Line | Premium | Premium | Superior | Superior | Premium | Premium | Premium | Superior | Superior | Superior | Value | Premium | Premium | Superior | Superior | Value | Value |
| Naming | E700Pa | E700Pa | E600Sa | E600Sa | E700Pi | E700Pi | E700Pi | E600Si | E600Si | E600Si | E600Vi | E700Pc | E700Pc | E600Sc | E600Sc | E600Vc | E600Vc |
| Flash Type | 3D MLC (pSLC mode) | 2D MLC (pSLC mode) | 3D MLC | 2D MLC | 3D TLC (pSLC mode) | 3D MLC (pSLC mode) | 2D MLC (pSLC mode) | 3D TLC | 3D MLC | 2D MLC | 3D TLC | 3D TLC (pSLC mode) | 2D MLC (pSLC mode) | 3D TLC | 2D MLC | 3D TLC | 3D TLC |
| IC Package | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA |
| JEDEC Specification | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 |
| Power Loss Protection Options | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based |
| Operating Temperature | -40°C to 105°C | -40°C to 105°C | -40°C to 105°C | -40°C to 105°C | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | -25°C to 85°C | -25°C to 85°C | -25°C to 85°C | -25°C to 85°C | -25°C to 85°C | -25°C to 85°C |
| Capacity1 | 8 GB to 64 GB | 4 GB to 8 GB | 16 GB to 128 GB | 8 GB to 16 GB | 10 GB to 40 GB | 8 GB to 64 GB | 4 GB to 8 GB | 32 GB to 128 GB | 16 GB to 128 GB | 8 GB to 16 GB | 32 GB to 64 GB | 10 GB to 40 GB | 4 GB to 8 GB | 32 GB to 128 GB | 8 GB to 16 GB | 32 GB to 64 GB | 64 GB to 128 GB |
| Sequential Read/ Write up to (MB/s) (Max.)2 | 300 / 240 | 230 / 100 | 300 / 170 | 230 / 100 | 290 / 225 | 300 / 240 | 230 / 100 | 290 / 225 | 300 / 170 | 230 / 100 | 290 / 225 | 290 / 225 | 230 / 100 | 290 / 225 | 230 / 100 | 290 / 225 | 290/220 |
| Bus Speed Modes | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 |
| ICC (Typical RMS in Read/Write) mA (Max.) | 145 / 175 | 85 / 65 | 125 / 175 | 85 / 50 | 100 / 110 | 145 / 175 | 85 / 65 | 100 / 110 | 125 / 175 | 85 / 50 | 100 / 110 | 100 / 110 | 85 / 65 | 100 / 110 | 85 / 50 | 100 / 110 | 105/80 3 |
| ICCQ (Typical RMS in Read/Write) mA (Max.) | 120 / 100 | 60 / 45 | 115 / 95 | 60 / 30 | 105 / 100 | 120 / 100 | 60 / 45 | 105 / 100 | 110 / 100 | 60 / 30 | 105 / 100 | 105 / 100 | 60 / 45 | 105 / 100 | 60 / 30 | 105 / 100 | 115 / 95 3 |
| Endurance TBW2 (Max.) | 1,213 TB | 200 TB | 824 TB | 40 TB | 1,364 TB | 1,213 TB | 200 TB | 52 TB | 824 TB | 40 TB | 20 TB | 1,364 TB | 200 TB | 52 TB | 40 TB | 20 TB | 24 TB |
| Reliability MTBF @ 25°C | >2,000,000 hours | >3,000,000 hours | >2,000,000 hours | >3,000,000 hours | >2,000,000 hours | >2,000,000 hours | >3,000,000 hours | >2,000,000 hours | >2,000,000 hours | >3,000,000 hours | >2,000,000 hours | >2,000,000 hours | >3,000,000 hours | >2,000,000 hours | >3,000,000 hours | >2,000,000 hours | >3,000,000 hours |
| Dimensions (mm) | 11.5 x 13.0 x 1.3 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.3 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.3 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.3 | 11.5 x 13.0 x 1.0 | 9.0 x 10.0 x 0.8 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 | 9.0 x 10.0 x 0.8 | 7.2 x 7.2 x 0.8 |
| Certifications | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH |
| Warranty | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year |
1. Low-density parity-check error correcting code. By product support.
2. All performance is collected or measured using ATP proprietary test environment, without file system overhead.
3. Product specifications may be subject to change.
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Related Resources
No doubt, each ATP e.MMC is manufactured to the highest and most stringent standards to make sure that it meets the rigid requirements of industrial applications. The ATP culture of excellence, however, extends after the product is finished. Further processes are taken to ensure that each product coming out of ATP's manufacturing facilities meet and even exceed expectations.
Below is a sneak peek into the meticulous processes that the ATP e.MMC goes through before it is shipped out.
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Ensuring Product Traceability Laser imprints important information to identify each piece for accurate tracking and efficient inventory management. |
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Rapid Diagnostic Test (RDT) RDT is performed to evaluate product reliability under extreme temperatures and to catch early and latent defects. ATP e.MMC devices are loaded into a specially designed RDT chamber for thermal cycling tests at both low (-40°C) and high (85°C) temperatures. ATP can perform high-volume testing according to customer request.
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Automated Final Screening A special machine performs high-speed automated initialization and screening to make sure that errors and failed parts not caught during the production stage are effectively screened out before the product is packaged.
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Protective Packaging Finally, the ATP e.MMC is vacuum-sealed, removing all the air from the packaging, including humidity and moisture that could cause corrosion. Vacuum packaging also safeguards the ATP e.MMC against environmental hazards that could cause damage while the devices are stored or in transit.
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ATP delivers total solutions by manufacturing not only best-in-class products, but also offering top-notch services. By project support and customer request, ATP offers value-added services such as Joint Validation, where ATP conducts compatibility and function tests with client-supplied host devices and systems to proactively detect and minimize failures that may not have been caught in production tests. ATP also guarantees long product cycles with a longevity commitment of over 5 years for MLC NAND-based e.MMC.
Find out how the industrial e.MMC and other ATP flash memory and storage products can meet your diverse data storage requirements.
Downloads
- ATP 7.2 eMMC product flyer
- ATP_2D_MLC_Storage_solutions
- ATP 2D eMMC product flyer
- ATP 9x10 eMMC product flyer
- ATP e.MMC 3D MLC and SLC Mode Reliability Report V2.0 Summary
- ATP_Automotive_Solutions_Customer specific only_v1.0_2023
- ATP eMMC product flyer