PCIe® Gen3 NVMe M.2 SSD

Key Features

  • Power Loss Protection: MCU-based* with data-at-rest and in-flight protection
  • Security: Self-Encrypting Drive (SED) with AES 256-bit encryption, TCG Opal 2.0*
  • End-to-End Data Path Protection
  • Thermal heatsink solutions**
* May vary by product and project support
** Customization available on a project basis

Description

ATP’s M.2 2280 NVMe solid state modules based on the NVMe™ protocol and leveraging the PCI Express® (PCIe®) Gen3 x4 interface deliver speedy, reliable, and enduring performance to fulfill the increasing data storage demands of today’s embedded and industrial applications. 

Constructed with 3D triple level cell (TLC) NAND flash, these modules are available in different capacities, ranging from 40 GB to 1 TB, to meet diverse data storage needs.ATP NVMe SSDs with industrial operating temperature rating deliver stable performance even in extreme temperatures ranging from -40°C to 85°C.

Select ATP M.2 2280 NVMe modules adopt a Customizable Thermal Management Solution. This includes firmware and hardware options, such as fin-type heatsink, to effectively dissipate heat and ensure optimal levels of sustained performance. 

SpecificationsLatest Update: 2025-01-23 11:48

PCIe® Gen3 NVMe M.2 SSD
Product LinePremiumPremiumSuperiorSuperiorValue ValueValue ValuePremium Value
NamingN750PiN700PiN650Si / N650ScN600Si / N600ScN650ViN600VcN650ViN600VcN700Pi / N700PcN600Vi / N600Vc
InterfacePCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4
Flash Type3D TLC (pSLC mode)3D TLC (pSLC mode)3D TLC3D TLC3D TLC3D TLC3D TLC3D TLC3D TLC (pSLC mode)3D TLC
Form FactorM.2 2280-D2-MM.2 2280-D2-MM.2 2280-D2-MM.2 2280-D2-MM.2 2280 S2-MM.2 2280 S2-MM.2 2242 D5-MM.2 2242 D5-MM.2 2230-S4-MM.2 2230-S4-M
Operating Temperature-40°C to 85°C-40°C to 85°C-40°C to 85°C / 0°C to 70°C-40°C to 85°C / 0°C to 70°C-40°C to 85°C0°C to 70°C-40°C to 85°C0°C to 70°C-40°C to 85°C / 0°C to 70°C-40°C to 85°C / 0°C to 70°C
Power Loss Protection OptionsHardware + Firmware BasedHardware + Firmware BasedHardware + Firmware Based or Firmware BasedHardware + Firmware Based or Firmware BasedFirmware Based Firmware BasedFirmware Based Firmware BasedFirmware Based Firmware Based
Optional SED FeaturesAES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0----AES 256-bit Encryption, TCG Opal 2.0 -
Capacity40 GB to 320 GB 40 GB to 640 GB120 GB to 960 GB120 GB to 960 GB120 GB to 960 GB120 GB to 960 GB120 GB to 960 GB120 GB to 960 GB40 GB to 160 GB120 GB to 480 GB
Sequential Read (MB/s) up to3,1503,1503,4203,4202,6002,6002,6002,6002,0002,050
Sequential Write (MB/s) up to2,6702,8203,0503,0501,8801,8701,8801,8701,6001,550
Random Reads IOPS up to147,789147,789222,700225,200250,800184,300250,800184,300135,600138,000
Random Writes IOPS up to114,227114,227176,600179,200276,400145,900276,400145,900112,000112,600
Endurance (TBW)1 up to16,000 TB21,300 TB4,640 TB2,793 TB4,880 TB1,390 TB4,880 TB1,390 TB4,280 TB768 TB
Reliability MTBF @ 25°C>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours>3,000,000 hours>3,000,000 hours>3,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours
Dimensions (mm)80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink)80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with with 8 mm heatsink)80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink)80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink)80.0 x 22.0 x 2.280.0 x 22.0 x 2.242.0 x 22.0 x 3.642.0 x 22.0 x 3.630.0 x 22.0 x 2.5 30.0 x 22.0 x 2.5
CertificationsCE, FCC, BSMI, UKCA, RoHS, REACHCE, FCC, BSMI, UKCA, RoHS, REACH CE, FCC, BSMI, UKCA, RoHS, REACHCE, FCC. BSMI, UKCA, RoHS , REACHCE, FCC, BSMI, UKCA, RoHS, REACH CE, FCC, BSMI, UKCA, RoHS, REACHCE, FCC, BSMI, UKCA, RoHS, REACH CE, FCC, BSMI, UKCA, RoHS, REACHCE, FCC, BSMI, UKCA, RoHS, REACH CE, FCC, BSMI, UKCA, RoHS, REACH
Warranty5 years5 years2 years2 years2 years2 years2 years2 years2 years2 years

1 Under highest Sequential write value. May vary by density, configuration and applications.

Ordering information

Hot Items Ordering Information
Product Line Capacity1 Operating Temperature2 Power Loss Protection3 SED4 P/N
N650Si 120GB -40°C to 85°C Hardware + Firmware Based - FT120GP38AG8BPI
N650Si 240GB -40°C to 85°C Hardware + Firmware Based - FT240GP38AG8BPI
N650Si 480GB -40°C to 85°C Hardware + Firmware Based - FT480GP38AG8BPI
N650Si 960GB -40°C to 85°C Hardware + Firmware Based - FT960GP38AG8BPI
N650Sc 120GB 0°C to 70°C Hardware + Firmware Based - FT120GP38AG8BPC
N650Sc 240GB 0°C to 70°C Hardware + Firmware Based - FT240GP38AG8BPC
N650Sc 480GB 0°C to 70°C Hardware + Firmware Based - FT480GP38AG8BPC
N650Sc 960GB 0°C to 70°C Hardware + Firmware Based - FT960GP38AG8BPC
N600Vc (M.2 2280) 120GB 0°C to 70°C Firmware Based - FT120GP38ANDBFC
N600Vc (M.2 2280) 240GB 0°C to 70°C Firmware Based - FT240GP38ANDBFC
N600Vc (M.2 2280) 480GB 0°C to 70°C Firmware Based - FT480GP38ANDBFC
N600Vc (M.2 2242) 120GB 0°C to 70°C Firmware Based - FT120GP34ANDBFC
N600Vc (M.2 2242) 240GB 0°C to 70°C Firmware Based - FT240GP34ANDBFC
N600Vc (M.2 2242) 480GB 0°C to 70°C Firmware Based - FT480GP34ANDBFC
N600Vc (M.2 2242) 960GB 0°C to 70°C Firmware Based - FT960GP34ANDBFC
1 Amount of actual usable storage that can be utilized.
2 Refers to Case Temperature range during device operation, as indicated by SMART temperature attributes.
3 Hardware + Firmware-based power loss protection design with Level 4 (data-in-flight) protection; Firmware-based power loss protection design with Level 1 (data-at-rest) protection.
4 Allows data written to and read from the SSD to be constantly and automatically encrypted and decrypted. Conforms to TCG Opal 2.0 and uses AES 256-bit HW encryption.

TechnologyView All Technologies

Technologies & Add-On ServicesProduct Line
PremiumSuperiorValue
S.M.A.R.T.
S.M.A.R.T.
available
available
available
Industrial Temperature
Industrial Temperature
available
customizable
available
Firmware-Based Data-At-Rest Power Loss  Protection
Firmware-Based Data-At-Rest Power Loss Protection
available
available
available
Hardware-Based In-Flight-Data Power Loss Protection
Hardware-Based In-Flight-Data Power Loss Protection
available
Advanced Wear Leveling
Advanced Wear Leveling
available
available
available
AutoRefresh
AutoRefresh
available
available
available
Dynamic Data Refresh
Dynamic Data Refresh
available
available
available
Auto-Read Calibration
Auto-Read Calibration
available
available
available
End-to End Data Path Protection
End-to End Data Path Protection
available
available
available
SED (AES 256-bit Encryption, TCG  Opal 2.0)
SED (AES 256-bit Encryption, TCG Opal 2.0)
available
available
customizable
Software Secure Erase
Software Secure Erase
available
customizable
available
Anti-Sulfur Resistors
Anti-Sulfur Resistors
customizable
customizable
Conformal Coating
Conformal Coating
customizable
customizable
Content Preload
Content Preload
customizable
Joint Validation and Test
Joint Validation and Test
customizable
customizable
customizable:Customization option available on a project basis.

Downloads

  • ATP M.2 NVMe product flyer
    English
    2024-10-29356.91KB
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