e.MMC Automotive

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Key Features

  • AEC-Q100 Grade 2 (-40°C to 105°C), and Grade 3 (-40°C to 85°C) compliant*
  • Robust Data Integrity* (AutoRefresh and Dynamic Data Refresh)
  • Extra-high endurance: 2-3X higher than standard e.MMC*
  • Complies with JEDEC e.MMC v5.1 Standard (JESD84-B51)
  • 153-ball FBGA (RoHS compliant, ""green package"")
  • LDPC ECC engine*
* May vary by product and project support
DescriptionSpecificationsTechnologyRelated Resources
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Description

ATP Electronics shifts into high gear with automotive grade e.MMC solutions.These soldered-down solutions are constructed for maximum reliability on the road. They deliver consistent, stable performance amidst the challenging and unpredictable conditions that vehicles are commonly subjected to, such as intense shocks and vibrations, temperature variability, and constricted spaces.Infotainment systems, advanced driver assistance system (ADAS), telematics, and other automotive applications will benefit greatly from the extra-high endurance, which is 2-3X higher than standard e.MMC.

The automotive grade e.MMC solutions are compliant with AEC-Q100 and are available in two temperature grades for peace-of-mind journeys, whether in sub-zero winters or in scorching summers. Automotive Grade 3 (AG3) typically covers an operating range of -40°C to 85°C), while Automotive Grade 2 (AG2) offers an extended range for even more extreme conditions with elevated temperatures, from -40°C to 105°C.

ATP’s automotive grade e.MMC solutions incorporate low-density parity-check error correction codes (LDPC ECC) to maintain data accuracy over their rated lifespan and beyond. AutoRefresh and Dynamic Data Refresh technologies prevent read disturb errors in often-accessed (hot zone) areas as well as seldom-accessed areas (cold zone).

SpecificationsLatest Update: 2025-02-07 14:22

e.MMC Automotive
Product NameAutomotive Grade 2Automotive Grade 2Automotive Grade 2Automotive Grade 2Automotive Grade 3Automotive Grade 3Automotive Grade 3Automotive Grade 3
Product LinePremiumPremiumSuperiorSuperiorPremiumPremiumSuperiorSuperior
NamingE700PaaE700PaaE600SaaE600SaaE700PiaE700PiaE600SiaE600Sia
Flash Type3D MLC (pSLC mode)2D MLC (pSLC mode)3D MLC2D MLC3D MLC (pSLC mode)2D MLC (pSLC mode)3D MLC2D MLC
IC Package153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA
JEDEC Specificationv5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400
Power Loss Protection OptionsFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware Based
Operating Temperature-40°C to 105°C-40°C to 105°C-40°C to 105°C-40°C to 105°C-40°C to 85°C-40°C to 85°C-40°C to 85°C-40°C to 85°C
Capacity18 GB to 64 GB4 GB to 8 GB16 GB to 128 GB8 GB to 16 GB8 GB to 64 GB4 GB to 8 GB16 GB to 128 GB8 GB to 16 GB
Sequential Read/Write up to (MB/s)2300 / 240230 / 100300 / 170230 / 100300 / 240230 / 100300 / 170230 / 100
Bus Speed Modesx1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8
ICC (Typical RMS in Read/Write) mA (Max.)145 / 17585 / 65125 / 17585 / 50145 / 17585 / 65125 / 17585 / 50
ICCQ (Typical RMS in Read/Write) mA (Max.)120 / 10060 / 45115 / 9560 / 30120 / 10060 / 45115 / 9560 / 30
Endurance TBW2 (Max.)1,213 TB200 TB824 TB40 TB1,213 TB200 TB824 TB40 TB
Reliability MTBF @ 25°C>2,000,000 hours>3,000,000 hours>2,000,000 hours>3,000,000 hours>2,000,000 hours>3,000,000 hours>2,000,000 hours>3,000,000 hours
Dimensions (mm)11.5 x 13.0 x 1.311.5 x 13.0 x 1.011.5 x 13.0 x 1.311.5 x 13.0 x 1.011.5 x 13.0 x 1.311.5 x 13.0 x 1.011.5 x 13.0 x 1.311.5 x 13.0 x 1.0
CertificationsAEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACH AEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACH AEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACH AEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACH
WarrantyOne YearOne YearOne YearOne YearOne YearOne YearOne YearOne Year

1. Low-density parity-check error correcting code. By product support.

2. All performance is collected or measured using ATP proprietary test environment, without file system overhead.

TechnologyView All Technologies

Technologies & Add-On ServicesProduct Line
PremiumSuperior
Life Monitor
Life Monitor
available
available
Industrial Temperature
Industrial Temperature
available
available
SiP (System in Package)
SiP (System in Package)
available
available
Vibration-Proof BGA Package
Vibration-Proof BGA Package
available
available
Firmware-Based Data-At-Rest Power Loss Protection
Firmware-Based Data-At-Rest Power Loss Protection
available
available
Advanced Wear Leveling
Advanced Wear Leveling
available
available
AutoRefresh
AutoRefresh
available
available
Dynamic Data Refresh
Dynamic Data Refresh
available
available
Auto-Read Calibration
Auto-Read Calibration
customizable
customizable
End-to End Data Path Protection
End-to End Data Path Protection
available
available
Content Preload
Content Preload
customizable
customizable
Joint Validation and Test
Joint Validation and Test
customizable
customizable
customizable:Customization option available on a project basis.

Related Resources

No doubt, each ATP e.MMC is manufactured to the highest and most stringent standards to make sure that it meets the rigid requirements of industrial applications. The ATP culture of excellence, however, extends after the product is finished. Further processes are taken to ensure that each product coming out of ATP's manufacturing facilities meet and even exceed expectations. 

Below is a sneak peek into the meticulous processes that the ATP e.MMC goes through before it is shipped out.

 

Ensuring Product Traceability

Laser imprints important information to identify each piece for accurate tracking and efficient inventory management.

Rapid Diagnostic Test (RDT)

RDT is performed to evaluate product reliability under extreme temperatures and to catch early and latent defects.

ATP e.MMC devices are loaded into a specially designed RDT chamber for thermal cycling tests at both low (-40°C) and high (85°C) temperatures. ATP can perform high-volume testing according to customer request.

 

Automated Final Screening

A special machine performs high-speed automated initialization and screening to make sure that errors and failed parts not caught during the production stage are effectively screened out before the product is packaged.

Protective Packaging

Finally, the ATP e.MMC is vacuum-sealed, removing all the air from the packaging, including humidity and moisture that could cause corrosion. Vacuum packaging also safeguards the ATP e.MMC against environmental hazards that could cause damage while the devices are stored or in transit.

 

ATP delivers total solutions by manufacturing not only best-in-class products, but also offering top-notch services. By project support and customer request, ATP offers value-added services such as Joint Validation, where ATP conducts compatibility and function tests with client-supplied host devices and systems to proactively detect and minimize failures that may not have been caught in production tests. ATP also guarantees long product cycles with a longevity commitment of over 5 years for MLC NAND-based e.MMC.

Find out how the industrial e.MMC and other ATP flash memory and storage products can meet your diverse data storage requirements. 

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