ATP Customizable Thermal Management Solutions

ATP SSDs deliver blazing-fast performance but their blistering speeds, along with extreme temperature variations and space-constricted embedded environments, can lead to heating issues that can compromise the stability of the storage device and the integrity of the stored data.

To make sure that blazing fast does not turn to blazing hot, ATP offers thermal management solutions that may be tailored depending on specific application requirements, different usage scenarios, and diverse operating environments.
 

The ATP Approach to Thermal Management: Steady Wins the Race

STEP 1: ASSESSMENT
Each customer faces a unique thermal challenge, so we make a careful assessment of these factors:
• System/mechanical criteria
• User applications 
• System specifications including, but not limited to: 
   o Temperature 
   o Airflow 
   o Mechanical design 
   o Workload and performance requirements

STEP 2: SIMULATION 
ATP’s thorough thermal simulation strategy addresses various facets such as component and mechanical considerations, firmware evaluations, environmental testing for drives, and ultimately simulating thermal environments with a mini chamber tailored to meet customers' specifications. 

ATP also uses AI-empowered simulation software, such as the Ansys Icepak and Cadence, to accurately analyze and predict the thermal performance of integrated circuits (ICs), printed circuit boards (PCBs), and other electronic components under various conditions.

STEP 3: CUSTOMIZATION 
Recognizing that one solution does not fit all scenarios, ATP continuously evaluate all aspects of our thermal solutions’ mechanical design, including examining materials, appearance, airflow, and assembly processes to ensure optimal thermal management. 

Considering the uniqueness of user and application requirements, ATP offers specialized and custom-configurable solutions.

STEP 4: OPTIMIZATION 
The ATP Dynamic Thermal Throttling utilizes firmware to prevent excessive temperature rise by continuously monitoring device temperature. This mechanism triggers Eco Mode, balancing performance and temperature, leading to lower power consumption. 

As the composite temperature rises, the SSD consistently slows down to cool, aided by an 8 mm heatsink and airflow support. This results in a lowered maximum composite temperature for the NVMe SSD, ensuring steady performance with an optimized firmware algorithm.

ATP Customizable Thermal Solutions Benefits
• Enhanced Performance and Endurance. With effective heat dissipation, components within the SSD avoid overheating, thus ensuring that they deliver dependable performance all the time and prolong the SSD lifespan.
• Adaptable to Specific Needs. ATP's customization capabilities allow the thermal solutions to be precisely aligned to unique application requirements.
• Cost Efficiency. Solutions that match exact thermal requirements helps reduce power consumption, resulting in huge power savings and overall energy efficiency.