Why ATP?
Since 1991, we have consistently distinguished ourselves as one of the world’s leading original equipment manufacturers (OEM) of high-performance, high-quality and high-endurance NAND flash products and DRAM modules. As a manufacturing leader, we provide memory and storage solutions trusted by diverse industries that require high levels of technical proficiency, manufacturing quality, and wide operating temperature ranges. We reinforce our leadership by continuing to blaze the trail as:
The Global Leader in Specialized Storage and Memory Solutions
ATP-developed firmware and mass production infrastructure are fully capable of addressing any variety of embedded/ industrial usage cases. We can provide specialized configurations to support unique memory and storage requirements, all with the aim of delivering best total cost of ownership (TCO) for our customers.
The Thermal Experts in Storage and Memory Solutions
We are widely known as one of the first to develop industrial-temperature (I-Temp) 3D NAND flash storage for extreme operating conditions. This expertise continues to this day as customizable thermal solutions are made available for the latest NVMe modules that run at blistering speeds. Through constant collaboration with customers, as well as our top-notch firmware and hardware engineering capabilities, we make sure that optimal sustained performance is achieved despite freezing cold or blazing hot temperatures.
A True Manufacturer
We manage every stage of the manufacturing process to ensure quality and product longevity, offering in-house design, testing, and tuning from integrated circuits (ICs) to module and drive level. All products are meticulously tested and validated before leaving our manufacturing facilities to make sure that they comply with the strictest industry standards and that they will operate reliably under rugged conditions and workloads for a long time.
ATP’s Complete Process Ownership
One size does not fit all. ATP recognizes the uniqueness of each customer’s requirements, so we go the extra mile to custom-configure our storage and memory solutions according to the needs of our customers.
We begin our Solution and Quality journey at the IC level. This serves as the foundation of all ATP products, maintaining complete control of its supply chains and taking charge of all stages.
Our Commitment: We Build With You.
Through Process Ownership, we craft the solution for your unique case. It is your solution, your product.
We also implement controlled bill of materials (BOM) with longevity planning. We maintain buffer inventory to prevent stock outs, ensuring steady access to valuable, often scarce resources. Any changes affecting the process or product, as well as product end of life, are communicated to our clients. We work together to forecast demand, enabling efficient supply planning and management.
All our products are designed, produced and tested at our own purpose-built factory with state-of-the-art equipment and world-class engineers, allowing us to meet and adapt to customer needs quickly. Our proprietary technologies and resources are available to customers, giving us the unique edge of managing every activity of the manufacturing process to ensure quality and product longevity while significantly restraining costs.
3 Stages of ATP's Process Ownership
For 30 years, companies around the world have trusted us to provide the best-in-class memory and flash storage products. Their confidence in the ATP name is rooted in our thorough and stringent testing and validation processes, which start from the component level up to the product level.
All DRAM and flash storage products go through a series of Functional and Reliability Tests to ensure that they match the specifications agreed upon by ATP and the customer and to ensure that they are compatible with different host environments.
-
NAND Flash IC Level
We ensure the reliability of the NAND flash via thorough meticulous IC-level validation for reliability and functionality.
-
Module Level
To ensure complete module functionality and reliability, we perform:
- Module design/layout validation
- Controller hardware validation
- Controller firmware/FTL (flash translation layer) validation
- OEM customer joint validation: Compatibility testing for new device; module-level validation with host platform
-
Mass Production Level
100% Rapid Diagnostic Test (RDT) performed during the pilot run ensures proven reliability at mass production (MP) scale.
This stage includes the following components :
Built-In Self-Test (BIST)
By incorporating additional hardware and software features, ICs can conduct functional and parametric tests on their own. This minimizes dependence on automated test equipment and eliminates the need for an external host or controller, so false failures due to host-related issues are reduced.
Wide Temperature
By incorporating additional hardware and software features, ICs can conduct functional and parametric tests on their own. This minimizes dependence on automated test equipment and eliminates the need for an external host or controller, so false failures due to host-related issues are reduced.
Complete Drive Test
For NAND flash storage products, the entire drive, including firmware, user and spare areas, is thoroughly tested. DRAM products also undergo complete testing, covering PHY and controller, including meta/mapping and data caching areas.
Reliability and Quality Trending
We make sure that products are consistently high in quality and meet all customers’specifications. ATP implements a rating and quality monitoring system, which entails classifying various gradesand establishing proper production-level screening mechanisms to ensure quality.
